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GLM50B资料 | |
GLM50B PDF Download |
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File Size : 116 KB
Manufacturer:SL Power Description:Offerings include ball grid array (BGA) packages with 0.80 mm, 1.00 mm, and 1.27 mm pitches. In addition to tra- ditional wire-bond interconnects, flip-chip interconnect is used in some of the BGA offerings. The use of flip-chip interconnect offers more I/Os than is possible in wire-bond versions of the similar packages. Flip-chip construction offers the combination of high pin count with high thermal capacity. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:GLM50B 厂 家:SL Power 封 装: 批 号:07+ 数 量:752 说 明:原装正品 |
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运 费:所有运费均有我司承担 所在地:深圳 新旧程度: |
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联系人:申小姐 |
电 话:0755-83330991,0755-83047629 |
手 机:15811820920 |
QQ:2355514181 |
MSN:chipstech-int@hotmail.com |
传 真:0755-61658118 |
EMail:sales@chipstech-int.com |
公司地址: 深圳市福田区中航路鼎城国际1017 |
1. 所有我司提供的货物,均为原厂原装正品! 2. 我们的报价是不含税价格。含税需要增加相应的税点。
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