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| OPB700ALZ资料 | |
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OPB700ALZ PDF Download |
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File Size : 116 KB
Manufacturer:OPTEK Description:Figure 1 shows a typical soldering profile for the D2 and D3 Packages when soldering a to a printed circuit board. The profile will vary from system to system and solders to solders. Factors that can affect the profile include the type of sol- dering system used, density and type of components on the board or substrate material being used. This profile shows temperature versus time. The two profiles described are based on a high density and a low density board. The type sol- der used was 62/36/2 Tin Lead Silver with a melting point between 177-189ºC. An convection/infrared soldering reflow system was used. The circuit and solder joints heat up first due to their mass followed by the components which typi- cally run 30 degrees cooler than the solder joints. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：OPB700ALZ 厂 家：OPTEK 封 装：N/A 批 号： 数 量：2651 说 明：原装正品 |
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运 费：所有运费均有我司承担 所在地：深圳 新旧程度： |
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| 联系人：申小姐 |
| 电 话：0755-83330991,0755-83047629 |
| 手 机：15811820920 |
| QQ：2355514181 |
| MSN：chipstech-int@hotmail.com |
| 传 真：0755-61658118 |
| EMail：sales@chipstech-int.com |
| 公司地址： 深圳市福田区中航路鼎城国际1017 |
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1. 所有我司提供的货物，均为原厂原装正品！ 2. 我们的报价是不含税价格。含税需要增加相应的税点。
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