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SN65LVDS9638DGKR资料 | |
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SN65LVDS9638DGKR PDF Download |
File Size : 116 KB
Manufacturer:TI Description:where TJ(max) is the maximum allowable junction tempera- ture of the die, which is 125C, and TA is the ambient operat- ing temperature. JA is dependent on the surrounding PC board layout and can be empirically obtained. While the JC (junction-to-case) of the SOT23-5 package is specified at 130C /W, the JA of the minimum PWB footprint will be at least 235C /W. This can be improved upon by providing a heat sink of surrounding copper ground on the PWB. Depending on the size of the copper area, the resulting JA can range from approximately 180C /W for one square inch to nearly 130C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing this value. The heat contributed by the dissipation of other devices located nearby must be included in design considerations. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:SN65LVDS9638DGKR 厂 家:TI 封 装: 批 号:07+ 数 量:14766 说 明:原装正品 |
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运 费:所有运费均有我司承担 所在地:深圳 新旧程度: |
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1. 所有我司提供的货物,均为原厂原装正品! 2. 我们的报价是不含税价格。含税需要增加相应的税点。
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