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SN65LVDS9638DGKR

SN65LVDS9638DGKR资料
SN65LVDS9638DGKR
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File Size : 116 KB
Manufacturer:TI
Description:where TJ(max) is the maximum allowable junction tempera- ture of the die, which is 125C, and TA is the ambient operat- ing temperature. JA is dependent on the surrounding PC board layout and can be empirically obtained. While the JC (junction-to-case) of the SOT23-5 package is specified at 130C /W, the JA of the minimum PWB footprint will be at least 235C /W. This can be improved upon by providing a heat sink of surrounding copper ground on the PWB. Depending on the size of the copper area, the resulting JA can range from approximately 180C /W for one square inch to nearly 130C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing this value. The heat contributed by the dissipation of other devices located nearby must be included in design considerations.
 
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  1PCS 100PCS 1K 10K  
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型 号:SN65LVDS9638DGKR
厂 家:TI
封 装:
批 号:07+
数 量:14766
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