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| SN74LVC1404YZPR资料 | |
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SN74LVC1404YZPR PDF Download |
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File Size : 116 KB
Manufacturer:TI Description:THERMAL PERFORMANCE The 24-lead SO package is a molded plastic package with a solid copper lead frame. Most of the heat generated at the die flows through the lead frame into the 3-ounce copper planes on the board. The board then acts as a heat sink. The junction-to-ambient thermal resistance of the packaged IC mounted on the board has been measured to be 38˚C/W, 37 ˚C/W, and 35 ˚C/W for the dissipation of 1.0W, 1.5W, and |
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| ◆ 44441-2002 | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：SN74LVC1404YZPR 厂 家：TI 封 装：8-DSBGA 批 号：07+ 数 量：5930 说 明：原装正品 |
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运 费：所有运费均有我司承担 所在地：深圳 新旧程度： |
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| 联系人：申小姐 |
| 电 话：0755-83330991,0755-83047629 |
| 手 机：15811820920 |
| QQ：2355514181 |
| MSN：chipstech-int@hotmail.com |
| 传 真：0755-61658118 |
| EMail：sales@chipstech-int.com |
| 公司地址： 深圳市福田区中航路鼎城国际1017 |
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1. 所有我司提供的货物，均为原厂原装正品！ 2. 我们的报价是不含税价格。含税需要增加相应的税点。
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