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TAS5162DDV资料 | |
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TAS5162DDV PDF Download |
File Size : 116 KB
Manufacturer:TI Description:The ISD4004 series utilizes separate analog and digital ground busses. The analog ground (VSSA) pins should be tied together as close to the pack- age as possible and connected through a low- impedance path to power supply ground. The digital ground (VSSD) pin should be connected through a separate low-impedance path to pow- er supply ground. These ground paths should be large enough to ensure that the impedance be- tween the VSSA pins and the VSSD pin is less than 3 W. The backside of the die is connected to VSS through the substrate resistance. In a chip-on- board design, the die attach area must be con- nected to VSS or left floating. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:TAS5162DDV 厂 家:TI 封 装: 批 号:07+ 数 量:20403 说 明:原装正品 |
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运 费:所有运费均有我司承担 所在地:深圳 新旧程度: |
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联系人:申小姐 |
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公司地址: 深圳市福田区中航路鼎城国际1017 |
1. 所有我司提供的货物,均为原厂原装正品! 2. 我们的报价是不含税价格。含税需要增加相应的税点。
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