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| TL3472CDE4资料 | |
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TL3472CDE4 PDF Download |
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File Size : 116 KB
Manufacturer:TI Description:The 3 Volt Intel® Advanced+ Boot Block Flash Memory (C3) Stacked-Chip Scale Package (Stacked-CSP) device delivers a feature-rich solution for low-power applications. The C3 Stacked-CSP memory device incorporates flash memory and static RAM in one package with low voltage capability to achieve the smallest system memory solution form-factor together with high-speed, low-power operations. The C3 Stacked-CSP memory device offers a protection register and flexible block locking to enable next generation security capability. Combined with the Intel® Flash Data Integrator (Intel® FDI) software, the C3 Stacked-CSP memory device provides a cost-effective, flexible, code plus data storage solution. |
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| 相关型号 | |
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| ◆ 172339-1 | |
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| ◆ 44441-2002 | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TL3472CDE4 厂 家：TI 封 装： 批 号：07+ 数 量：5431 说 明：原装正品 |
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运 费：所有运费均有我司承担 所在地：深圳 新旧程度： |
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| 联系人：申小姐 |
| 电 话：0755-83330991,0755-83047629 |
| 手 机：15811820920 |
| QQ：2355514181 |
| MSN：chipstech-int@hotmail.com |
| 传 真：0755-61658118 |
| EMail：sales@chipstech-int.com |
| 公司地址： 深圳市福田区中航路鼎城国际1017 |
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1. 所有我司提供的货物，均为原厂原装正品！ 2. 我们的报价是不含税价格。含税需要增加相应的税点。
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建议使用分辨率:1024*768