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| TLC2274AMDREP资料 | |
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TLC2274AMDREP PDF Download |
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File Size : 116 KB
Manufacturer:TI Description: Many conditions affect the thermal performance of the power module, such as orientation, airflow over the module and board spacing. To avoid exceeding the maximum temperature rating of the components inside the power module, the case temperature must be kept below 95C. The derating curves are determined from measurements obtained in an experimental apparatus. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TLC2274AMDREP 厂 家：TI 封 装： 批 号：07+ 数 量：24821 说 明：原装正品 |
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运 费：所有运费均有我司承担 所在地：深圳 新旧程度： |
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| 联系人：申小姐 |
| 电 话：0755-83330991,0755-83047629 |
| 手 机：15811820920 |
| QQ：2355514181 |
| MSN：chipstech-int@hotmail.com |
| 传 真：0755-61658118 |
| EMail：sales@chipstech-int.com |
| 公司地址： 深圳市福田区中航路鼎城国际1017 |
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1. 所有我司提供的货物，均为原厂原装正品！ 2. 我们的报价是不含税价格。含税需要增加相应的税点。
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