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| TLC542IFN资料 | |
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TLC542IFN PDF Download |
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File Size : 116 KB
Manufacturer:TI Description:This model provides a more precise description of the thermal charac- teristics to be used for thermal calculations. Thermally the power module can be considered as a component and the case temperature can be used to characterize the properties. The thermal data for a power module with the substrate in contact with the case can be described with two thermal resistances. One from the case to ambient air and one from case to PB (Printed Board). The thermal characteristics can be calculated from the following formula: |
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| ◆ 44441-2002 | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TLC542IFN 厂 家：TI 封 装： 批 号：07+ 数 量：9659 说 明：原装正品 |
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运 费：所有运费均有我司承担 所在地：深圳 新旧程度： |
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| 联系人：申小姐 |
| 电 话：0755-83330991,0755-83047629 |
| 手 机：15811820920 |
| QQ：2355514181 |
| MSN：chipstech-int@hotmail.com |
| 传 真：0755-61658118 |
| EMail：sales@chipstech-int.com |
| 公司地址： 深圳市福田区中航路鼎城国际1017 |
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1. 所有我司提供的货物，均为原厂原装正品！ 2. 我们的报价是不含税价格。含税需要增加相应的税点。
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建议使用分辨率:1024*768