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| TLV2470IDBVTG4资料 | |
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TLV2470IDBVTG4 PDF Download |
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File Size : 116 KB
Manufacturer:TI Description:Each power pin must have its own set of blocking capacitors. An external reference must be used. VSSA and VSS must be connected on the TLV2470IDBVTG4CB level. The two power pads can be bonded to one package pin (double bonding). Two more TLV2470IDBVTG4 cells can be driven with IREFxx of the TLV2470IDBVTG4ERXBIAS cell. If an output IREFxx is not used it must be left unconnected. The TLV2470IDBVTG4ECL part of the chip has to be separated from the rest of the chip by use of snap backs (cell TLV2470IDBVTG4WRCUT_DIG_TLV2470IDBVTG4_SNATLV2470IDBVTG4_SNATLV2470IDBVTG4). The cells VDD3R1TLV2470IDBVTG4 and VDD3R2TLV2470IDBVTG4 are not in the standard library, they are part of the ITLV2470IDBVTG4-block. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TLV2470IDBVTG4 厂 家：TI 封 装： 批 号：07+ 数 量：6996 说 明：原装正品 |
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运 费：所有运费均有我司承担 所在地：深圳 新旧程度： |
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| 联系人：申小姐 |
| 电 话：0755-83330991,0755-83047629 |
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| 公司地址： 深圳市福田区中航路鼎城国际1017 |
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1. 所有我司提供的货物，均为原厂原装正品！ 2. 我们的报价是不含税价格。含税需要增加相应的税点。
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