 |
|||||||
|
|||||||
|
|
|||||||
|
|||||||
|
|
| TLV2473IDGQR资料 | |
|
TLV2473IDGQR PDF Download |
|
File Size : 116 KB
Manufacturer:TI Description:Thick metal clad ground planes restrict the thermal expansion of the dielectric substrates in the X-Y axis. The expansion of the dielec- tric will then be mainly in the Z axis, which does not affect the beam lead device. An alternate solution to the problem of dielec- tric ground plane expansion is to heat the substrate to the maxi- mum required operating tempera- ture during the beam lead attach- ment. Thus, the substrate is at maximum expansion when the device is bonded. Subsequent cooling of the substrate will cause bugging, similar to bugging in thermocompression bonding or epoxy bonding. Other methods of bugging are preforming the leads during assembly or prestressing the substrate. |
|
| 相关型号 | |
| ◆ PJ-037A-SMT | |
| ◆ FZT591ATA | |
| ◆ 2-520081-2 | |
| ◆ 2-520103-2 | |
| ◆ G3VM21GR | |
| ◆ B40B-XADSS-N(LF)(SN) | |
| ◆ S301T-RO | |
| ◆ 172339-1 | |
| ◆ V7-5F17D8-336 | |
| ◆ 44441-2002 | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
|
型 号：TLV2473IDGQR 厂 家：TI 封 装： 批 号：07+ 数 量：30667 说 明：原装正品 |
|||||
|
运 费：所有运费均有我司承担 所在地：深圳 新旧程度： |
|||||
| 联系人：申小姐 |
| 电 话：0755-83330991,0755-83047629 |
| 手 机：15811820920 |
| QQ：2355514181 |
| MSN：chipstech-int@hotmail.com |
| 传 真：0755-61658118 |
| EMail：sales@chipstech-int.com |
| 公司地址： 深圳市福田区中航路鼎城国际1017 |
|
1. 所有我司提供的货物，均为原厂原装正品！ 2. 我们的报价是不含税价格。含税需要增加相应的税点。
|
建议使用分辨率:1024*768