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TLV2774IDG4

TLV2774IDG4资料
TLV2774IDG4
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File Size : 116 KB
Manufacturer:TI
Description:  For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings make up a heating profile for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 9 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time.
 
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  1PCS 100PCS 1K 10K  
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型 号:TLV2774IDG4
厂 家:TI
封 装:
批 号:07+
数 量:7187
说 明:原装正品
 
 
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