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TLV4112IDGN

TLV4112IDGN资料
TLV4112IDGN
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File Size : 116 KB
Manufacturer:TI
Description:MECHANICAL INFORMATION Electrical connection to the SOIC is made through four pins that connect to the four press fitted sock- ets at each end of the SOIC. Critical contact points between the pins and sockets are gold-plat- ed to resist oxidation. Internally, each socket con- tains six independent contact fingers to form redundant connections between the two compo- nents. These sockets were designed with high point contact force to provide the lowest possible contact resistance. The SNAPHAT top also incor- porates four molded-in retaining clips which hold onto the ends of the SOIC insuring mechanical and electrical connection even under severe me- chanical shock and vibration. The combined SOIC and SNAPHAT assembly can sustain shock levels in excess of 100 g without separating. This pack- age also passes variable frequency testing in ac- cordance with MIL-STD-883, method 2007.2, condition A. Figure 2 illustrates the affect of repeated insertion and extraction of the SNAPHAT top to the SOIC. The force required to extract the SNAPHAT, and then to re-insert it, reduces each time. After three or four extractions, though, the reduction starts to become unnoticeable, and the force required remains at a fairly constant figure. Typically, though, the SNAPHAT will only need to be extracted and re-inserted once in its lifetime.
 
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型 号:TLV4112IDGN
厂 家:TI
封 装:
批 号:07+
数 量:7351
说 明:原装正品
 
 
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