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| UCC5630AMWP资料 | |
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UCC5630AMWP PDF Download |
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File Size : 116 KB
Manufacturer:TI Description:2. The ground pad of the CX65105 PA has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the amplifier. As such, design the connection to the ground pad to dissipate the maximum wattage produced to the circuit board. Multiple vias to the grounding layer are required. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：UCC5630AMWP 厂 家：TI 封 装： 批 号：07+ 数 量：7865 说 明：原装正品 |
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运 费：所有运费均有我司承担 所在地：深圳 新旧程度： |
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| 联系人：申小姐 |
| 电 话：0755-83330991,0755-83047629 |
| 手 机：15811820920 |
| QQ：2355514181 |
| MSN：chipstech-int@hotmail.com |
| 传 真：0755-61658118 |
| EMail：sales@chipstech-int.com |
| 公司地址： 深圳市福田区中航路鼎城国际1017 |
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1. 所有我司提供的货物，均为原厂原装正品！ 2. 我们的报价是不含税价格。含税需要增加相应的税点。
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